LTrin is a semiconductor equipment company developing productivity- and cost-competitive wafer hybrid bonders, built on three core technologies: Real-view Alignment, RF Induction Heating, and Cleanable AP Plasma.
Clearly differentiated from global competitors.
A glass-based monitoring specimen paired with high-resolution visible-light CMOS vision recognizes alignment keys directly, assisted by indirect recognition — without costly NIR/SWIR hardware.
Independently variable RF induction heating for the upper and lower stages delivers dramatically faster heating and cooling than resistive heating, maximizing throughput.
Combines surface activation and nano-spray cleaning in a single hybrid module — unlike competitors' two-module vacuum plasma systems — cutting footprint and shortening TACT.
Watch LTrin's wafer bonding equipment in operation — precision alignment, cleanable plasma treatment, and thermocompression bonding.
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SUB-100NM HYBRID BONDER
